TSMC 3D IC packaging tech

Senior TSMC R&D Manager Joins Samsung’s Chip Packaging Team

A senior R&D govt with practically twenty years of expertise at TSMC just lately took a place at Samsung. Semiconductor trade staff chatting with Taiwanese DigiTimes described the senior govt’s transfer as “uncommon” and a “risk” to TSMC’s hegemony.

Lin Jun-Cheng started his lengthy tenure at TSMC in 1999 after a stint at Micron Expertise. The supervisor labored in TSMC’s superior packaging and testing division and has been described as a driving power in growing packaging applied sciences similar to CoWoS and InFO. Earlier than leaving TSMC in 2017, Lin was Deputy Director of the R&D division. Within the interim, he labored because the CEO of Skytech, a semiconductor tools firm in Taiwan, and accrued manufacturing expertise for packaging tools. His new place at Samsung is Vice President of Superior Packaging Enterprise.

(Picture credit score: TSMC)

Stories point out that Lin’s time at TSMC didn’t present the chance to deal instantly with prospects. Maybe he gained rather more from such experiences underneath Skytech’s most up-to-date stewardship. Nonetheless, TSMC’s work in 3D IC packaging was fairly widespread with key foundry prospects similar to Nvidia, Apple, AMD and numerous HPC specialist firms. As well as, Lin helped the agency receive greater than 400 patents throughout his TSMC R&D profession.

(Picture credit score: TSMC)

It is price taking a better have a look at Lin’s newest experiences at Skytech. The corporate really makes foundry instruments to assist 2.5D and 3D packaging. Lin helped Skytech receive greater than 100 patents.

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