SK Hynix Instances 24GB HBM3 Modules: Up to 819GB/s
owned by SK Hynix announced mentioned it has developed the trade’s first 12-layer 24GB HBM3 reminiscence stacks that provide each excessive density and excessive bandwidth of 819GB/s. The 12-Hello HBM3 merchandise preserve the identical peak as the corporate’s current 8-layer HBM3 merchandise, which implies they’re straightforward to put in.
SK Hynix’s 24 GB HBM3 identified good stack overlay (KGSD) product embeds twelve 16 Gb reminiscence units linked utilizing silicon means (TSVs) on a base layer with a 1024-bit interface. The machine has an information switch fee of 6400 MT/s and due to this fact the whole 24GB HBM3 module gives 819.2GB/s bandwidth.
Relying on the precise reminiscence subsystem, such modules can present 3.2 TB/s – 4,915 TB/s bandwidth for 96 GB reminiscence over 4096 bits or 144 GB reminiscence over 6140 bit interface, respectively. To place the numbers in context, Nvidia’s H100 NVL, probably the most superior HBM3 implementation so far, has 96GB of reminiscence with 3.9TB/s bandwidth for every of the 2 GH100 compute GPUs.
Stacking 12 layers of HBM DRAM is troublesome for a number of causes. First, it’s troublesome to drill about 60,000 or extra TSV holes by way of the bundle to tie all twelve layers collectively. Second, 12-Hello HBM DRAM packages can not bodily go increased than 8-Hello HBM KGSDs (sometimes, 700 – 800 micron, 720 micron Within the case of Samsung), so putting in such HBM3 KGSDs close to a fixed-height CPU or GPU (if potential) can be extraordinarily difficult. To this finish, DRAM producers akin to SK Hynix must both cut back the thickness of a single DRAM layer, or cut back the hole between layers and shrink the bottom layer, with out sacrificing effectivity or efficiency (which poses many challenges).
SK Hynix says it makes use of Superior Mass Reflow Molded Backside Fill (MR-MUF) encapsulation know-how, which features a bulk reflow (MR) chip insert to shrink the half, to create the 12-Hello HBM3 product that’s the similar peak because the 8Hi HBM3 machine. base layer and molded underfill (MUF) processes to scale back mold-to-mold cavity.
SK Hynix has delivered samples of its 24GB HBM3 to numerous eagerly awaiting prospects. The product, which is at present present process efficiency analysis, is deliberate to enter mass manufacturing within the second half of the yr.
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