SK Hynix's 300-Layer 3D NAND to Increase SSD Performance and Reduce Costs

SK Hynix’s 300-Layer 3D NAND to Increase SSD Performance and Reduce Costs

SK Hynix lately launched particulars about its eighth Gen 3D NAND reminiscence machine with over 300 energetic layers. The corporate’s new 3D NAND units will permit SSDs to enhance efficiency and decrease their value per TB after they grow to be out there within the 2024-2025 timeframe.

SK Hynix’s first eighth Gen 3D NAND machine with greater than 300 layers will include 1TB (128GB) capability with tri-level cells and a bit density of over 20Gb/mm^2. Moreover, the chip has a web page dimension of 16 KB, quad-planes, a 2400 MT/s interface, and a most throughput of 194 MB/s (18% larger than seventh Gen 238-layer 3D NAND). Excessive-speed I/O and elevated throughput will likely be particularly helpful for the most effective SSDs with a PCIe 5.0 x4 or larger interface.

SK Hynix

(Picture credit score: SK Hynix)

Practically doubling the bit density of the brand new NAND will considerably improve the brand new manufacturing node’s productiveness per wafer, which is able to decrease SK Hynix’s prices, but it surely’s unclear how a lot.

#Hynixs #300Layer #NAND #Improve #SSD #Efficiency #Cut back #Prices

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